Other Applications
As glass emerges as a future candidate for optical connectivity and interposer applications, many groups are also considering the challenge of co-packaging electronic functions in glass.
It should be noted that glass is an electrical insulator and techniques to provide the electrical connections for a glass interposers are receiving a lot of attention. One approach of interest is Laser Induced Chemical Etching, wherein an ultrafast laser processes an area of glass, which is subsequently removed with a wet, alkaline etch and back filled with a metal to provide the electrical connections.
Opsydia is active in this area together with other UK partners and is able to provide solutions for through glass vias (TGVs) with electrical functionality.
Laser Assisted Chemical Etching
Overcomes material induced optical aberrations
Nitrogen Vacancies
Improved feature size & elimination of material damage
Gemstones
Overcomes material induced optical aberrations
For more information contact our team using the button below.
Available on all devices
Capable of melee inscriptions
Suitable for coloured gemstones
High capacity (100k+ stones p/a)
Encryption secure IDs
Automation and machine vision
Remote service and diagnostics
Integrates with blockchain traceability solutions
Integrates with factory IM systems
Multiple stone loading
Available on all devices
Capable of melee inscriptions
Suitable for coloured gemstones
High capacity (100k+ stones p/a)
Encryption secure IDs
Automation and machine vision
Remote service and diagnostics
Integrates with blockchain traceability solutions
Integrates with factory IM systems
Multiple stone loading
Latest News
Opsydia at Laser World of Photonics 2025 in Munich
Opsydia attends the world’s leading trade fair in Munich in June 2025
Opsydia attended OFC 2025
Opsydia attended the OFC 2025 Conference from March 30-April 5, 2025 at the Moscone Center in San Francisco
Contact Us
To find out more about the Opsydia Systems or to discuss a trial or demonstration, please speak to a member of our team.